Copper plating has been extensively employed in the fabrication of embedded packaging to reach high-density, high-speed, high performance electronic products. With through holes (TH) as well as blind ...
The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...
San Jose, California – October 20, 2009 – Novellus Systems (NASDAQ: NVLS) today introduced the SABRE Excel, an advanced copper electroplating system designed to provide industry-leading fill and ...
Cyclic voltammetric stripping (CVS) analysis can be used to facilitate the detection of mercaptopropylsulfonic acid (MPS). MPS is the breakdown product of bis ...
The UNSW researchers used copper plating on the front grid of TOPCon cells to reduce performance losses linked to contaminants. Image: UNSW/Solar Energy Materials and Solar Cells, CC BY 4.0.
Researchers at the University of New South Wales have used a 1 µm copper plating layer on the front silver grid of a TOPCon solar cell to create a protective barrier that reportedly reduces corrosion ...
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