Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...

Thinner fins employed in ultra-high ratio extrusion heat sinks for power semiconductors provide more surface area per unit width, at lower cost than their predecessors. Also, they reduce air flow back ...

Increasing the processing power of electronic equipment often means that more transistors have to be squeezed into tighter packages. And higher circuit densities increase the amount of heat that must ...

The heat generated from large power semiconductors such as IGBTs, diodes, or thyristors can be as high as several kilowatts. While conventional extruded heat sinks have been one of the most widely ...

Developed by Malaysian scientists, the proposed multi-level aluminum fin heat sinks (MLFHS) were found able to reduce the module operating temperature by up to 8.45 degrees Celsius and increase power ...

In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.