Munich, Germany – The EXM32 SOM specification developed by MSC offers interested companies the possibility to design and market EXM32-based products. The goal is to make the already widely spread ...

Why board-level standardization of FPGA implementations matter. What the Harmonized FPGA Module (HFM) standard entails. How semiconductor manufacturers, embedded module manufacturers, VARs, system ...

Irvine, CA - AnyDATA Corporation, a global leader in the design and manufacture of wireless communications devices, announced the DTW series of low cost embedded CDMA and GSM/HSPA modules designed for ...

PITTSBURGH--(BUSINESS WIRE)--Arieca, a leader in liquid-metal-based Thermal Interface Materials (TIM), entered into a joint research agreement with ROHM Co., Ltd., a leading provider of power ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

With support for mmWave, Sub-6 GHz and LTE, Sierra Wireless modules will enable original equipment manufacturers to securely deploy 5G worldwide VANCOUVER, British Columbia--(BUSINESS WIRE)--Sierra ...

The rise of non-PC architectures for mobile phones and tablets extends the benefits of off-the-shelf computing platforms into new markets, where portable and low-energy applications are necessary but ...

Developments and trends on the electronics market are generally quickly reflected on the electrical medical equipment market. Cost pressure and time constraints are also heightened here, forcing ...

ADLINK Technology has launched the COM-HPC-mMTL – an embedded module that is the only small form factor solution that's available with Intel Core Ultra architecture and rich I/O capabilities.

Dutch researchers used dynamic modelling to uncover the demand for silicon-based PV materials used in a wide range silicon PV technologies, including perovskite-silicon tandem and back-contact modules ...