A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...
Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...
Gold-on-gold stud-bumps comprise a connection technique used in some microminiature flip-chip assemblies: (a) shows bumps on an IC; (b) is a close-up view. Flip-chip processes allow miniaturization of ...
New research paper titled “Hybrid silicon photonics DBR laser based on flip-chip integration of GaSb amplifiers and µm-scale SOI waveguides” by researchers at Tampere University (Finland). “The ...
Daktronics has released its Flip-Chip COB (Chip On Board) LED display technology. The latest addition to its Narrow Pixel Pitch (NPP) product family brings tighter pixel spacings ranging from ...
Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...
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