A collaborative research team from Nagoya University and Tokyo Electron Miyagi Ltd. has demonstrated that the company's new ...

Plasma chemistry and etching processes form the backbone of modern semiconductor fabrication, enabling the precise patterning and removal of material layers essential to device performance. By ...

In circuitry, etching is used to remove the deformed layer created during the grinding and polishing of metal components by selective chemical attack. Now, a research group at Nagoya University in ...

In this interview, AZoM talks to Bas Derksema about advancements in plasma etching and deposition processes for compound semiconductor materials applications. Please could you introduce yourself and ...

The field of plasma research is still in its infancy, but there are already some devices being produced that make use of this powerful technique. Hiden Analytical manufacture plasma analyzers that ...

After years in R&D, several fab tool vendors last year finally began to ship systems based a next-generation technology called atomic layer etch (ALE). ALE is is moving into 16/14nm, but it will play ...

Both capacitively (RIE) and inductively (ICP) coupled plasma etcher with fluorine-based gases (CF4, CHF3, C4F8, SF6), BCl3, nitrogen, argon, and oxygen for anisotropic dry etching of Si-based ...

After years in R&D, a technology called cryogenic etch is re-emerging as a possible option for production as the industry faces new challenges in memory and logic. Cryogenic etch removes materials in ...

What is Reactive Ion Etching (RIE)? Reactive Ion Etching (RIE) is a dry etching technique widely used in the fabrication of micro- and nanodevices. It combines the chemical reactivity of reactive ...