IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...

Direct Insight is to offer KaRo’s 27 x 27mm system on module that pairs a 1.2GHz dual-core Arm Cortex-A35 processor with 1Gbyte of LPDDR4, 4Gbyte of eMMC flash and an NPU. Called QSMP-23, “this solder ...

TEL AVIV, Israel--(BUSINESS WIRE)--Variscite, a leading worldwide System on Module (SoM) designer, developer and manufacturer, will showcase live demos of its latest SoMs at Embedded World 2025, held ...

Innovations in embedded modules are on full display at embedded world 2024. Modules, including computer-on-modules (COMs), system-in-packages (SIPs) and system-on-modules (SOMs), are designed to ...

The previous articles of this series have discussed the innovation and evolution of the integrated-circuit industry and how system-in-package (SiP) devices fit into the market. In the first article, ...

Aimed at applications that need to transition from a microcontroller (MCU) to a microprocessor (MPU) to handle increased processing requirements, Microchip Technology Inc. has expanded its MPU-based ...