IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...

Vision Components (VC) will present its new VC MIPI IMX454 Camera Module at SPIE Photonics West, taking place from January ...

After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT ...

Binocular Full-Color AR Glasses Reference Design "Rubis" Debuts with Tri-Chip Architecture and EMG Interaction The path to mainstream adoption of consumer AI-powered AR glasses has been hindered by ...

Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the ...

We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, ...

Smart lights that know where they’re placed in a room, wild designs for next-gen routers, and a glowing inedible donut.

The approved proposals include manufacturing of 11 target segment products such as mobile manufacturing, telecom, consumer ...

Shares of oil marketing companies, several large and medium-sized banks like Bank Of Baroda, Marico Ltd., Bajaj Finance Ltd., ...

In a major push to boost domestic manufacturing, the government has approved 22 proposals under the third tranche of the ...

Four chip companies are slated to begin commercial production this year --- with almost all the top automobile and telecom ...

Projected investment of INR 41,863 crore, and projected production of INR 2,58,152 crore. Approvals are expected to generate ...