Partnership addresses the needs of hardware engineers facing reliable power distribution problems during printed circuit board (PCB) design and layout Electromagnetic (EM) simulation technology ...

January 29, 2014. At DesignCon, Altium, a global provider of design automation and embedded software development tools, teamed up with Nimbic, a provider of electromagnetic simulation solutions for ...

EDA 2023 Suite Includes 2.5/3DIC SI/PI Simulation for Advanced Packaging,3D EM Simulation, SI/PI and Multiphysics Analysis, High-Speed System Simulation Continuous Demonstrations This Week at Design ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence ® Voltus ™-XFi Custom Power Integrity Solution, a custom electromigration and IR drop (EM ...

As data rates soar into the multi-gigabit range, high-speed digital (HSD) PCB design is no longer just about connecting the dots. Signal integrity (SI) and power integrity (PI) challenges can silently ...

Power Integrity for I/O Interfaces: With Signal Integrity/Power Integrity Co-Design, by Vishram S. Pandit, Woong Hwan Ryu, and Myoung Joon Choi, Prentice Hall Modern Semiconductor Design Series, ...

Issues in GDDR6 design. In-design analysis for signal integrity and power integrity. Innovative workflow for GDDR6 design and analysis. Graphics processing units (GPUs) and graphics double-data-rate ...

Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be much more challenging with chiplets and advanced packaging than in monolithic SoCs ...

The previous articles in this series showed how the successful integration of IP—especially analog/RF, but digital as well—is essentially pre-determined by the practices of the chip development team ...

A structured design review process ensures alignment across teams.